Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.

以氧树脂为基体,间苯二胺和二氨基二苯甲烷低融点混合物为固化剂,铜粉为导电填料,制固化各向同性导电胶。