Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
氧树脂
基体,间苯二胺和二氨基二苯甲烷的低融点混合物固化剂,铜粉导电填料,制备了热固化各向同性导电胶。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
氧树脂基体,间苯二胺和二氨基二苯甲烷的低融点混合物固化剂,铜粉导电填料,制备了热固化各向同性导电胶。
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