A prototype of high frequency induction heating power is developed by multidevice parallel connection and using power MOSFETs as the power switch.
以功率MOSFET为开关元件,采用多管并联方式研制出高频感应加
。
A prototype of high frequency induction heating power is developed by multidevice parallel connection and using power MOSFETs as the power switch.
以功率MOSFET为开关元件,采用多管并联方式研制出高频感应加。
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