In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.
在印刷电路板的生产过程中,会产生整洁、阻焊均匀、文字偏移、线路及焊盘破等缺陷。
In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.
在印刷电路板的生产过程中,会产生整洁、阻焊均匀、文字偏移、线路及焊盘破等缺陷。
声明:以上例句、词性分类均由互联自动生成,部分未经过人工审核,其表达内容亦代表本软件的点;若发现问题,欢迎向我们指正。