A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process.
在迴焊过程中,因BGA锡球内孔隙有气
而形成吹孔.
A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process.
在迴焊过程中,因BGA锡球内孔隙有气而形成吹孔.
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